Crystal

Natural or synthetic piezoelectric or semiconductor material with atoms arranged with some degree of geometric regularity.
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Crystal Oscillators

Crystal Oscillator

A Crystal Oscillator is an electronic oscillator circuit that uses the mechanical resonance of a vibrating crystal of piezoelectric material to create an electrical signal with a constant frequency. This frequency is often used to keep track of time, as …
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CSOP

What’s CSOP Package?   Ceramic Small Outline Package (CSOP or C-SOP) is a surface-mount IC package with gull wing leads on two sides of the small outline package (SOP) body. The lead pitch is always 1.27mm. The lead count includes …
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CSP

What’s Chip Scale Package (CSP)?   A Chip Scale Package, or Chip-Scale Package (CSP) is a type of integrated circuit (IC) packages. Originally, CSP was the acronym for Chip-Size Packaging. Since only a few packages are chip size, the meaning …
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CTE

The Coefficient of Thermal Expansion, or CTE, is the rate of expansion of a PCB material as it heats up. CTE is expressed in parts per million (ppm) expanded for every degree Celsius that it is heated. As a material’s …
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CTI

Comparative Tracking Index (CTI) is used to measure the electrical breakdown properties of the insulating material used in PCBs. It is primarily used to assess electrical safety especially for human users of electrical devices. PCB material manufacturers will provide these …
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Curing

The process of polymerizing (chemically hardening) the epoxy based soldermask and/or silkscreen using a set temperature for a specified amount of time. This ensures the mask and silk will adhere to the rest of the material. Once the mask and …
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Curing Time

The time needed to complete curing of an epoxy at a certain temperature.
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Current

Measured in amps, it is the flow of electrons through a conductor.
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Cut-outs

Removal of an internal area of the board. See Slots and Cutouts.
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