PCB Capabilities -Rigid, Flex, Rigid-Flex PCBs Manufacturer

PCB Capabilities

MADPCB is a one-stop PCB solution service provider, fabricator, assembler and design company, offers PCB manufacturing, assembly and design services. Here we offer a full range of PCB capabilities to fit all of your PCB needs, including rigid, IMS, flex and rigid-flex PCBs with thru-hole, buried and blind vias through mechanical drilling and laser drilling formation techniques.

PCB Capabilities

MADPCB’s advanced PCB manufacturing technology and facility supports quick-turn PCB prototypes, low to high volume production runs with continuous stable performance in your final electronic devices. We list our PCB Capabilities below for your better understanding whether they are a match for your PCB design. It will also allow you to plan ahead and create your design within these capabilities, so that you can be sure we can produce your PCB.

Manufacturing Capabilities		Rigid PCB	MCPCB	Flex PCB (FPC)	Rigid-Flex PCB
Material	Base Material	FR4 PTFE Ceramic-Filled Ceramic + PTFE	Aluminum Core Copper Core Ceramic (Al₂O₃) Core	Polyimide (PI) with or without adhesive with RA or ED copper	FR4 + PI
	CCL Brand	ITEQ, ShengYi, KB, TUC, NanYa, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, Ventec	Ventec, GDM, BoYu	ITEQ, Taiflex, Dupont, Doosan, Panasonic	ITEQ, ShengYi, TUC, NanYa, Panasonic, Isola, Ventec, Taiflex, Dupont, Doosan, Panasonic
	CCL Type	Standard FR4 High Frequency High Speed High Tg Low CTE Low DK Low Loss Halogen Free Lead Free	Normal to High Thermal Conductivity	Normal to Low DK	All kinds FR4 (Tg>=150) + PI, except for PTFE and Ceramic base materials.
	Coverlay	N	N	ITEQ, Dupont, Panasonic, ZhengYe	ITEQ, Dupont, Panasonic, ZhengYe
	Stiffener Material	N	N	FR4, PI, PET, Alu, Stainless Steel	FR4, PI, PET, Alu, Stainless Steel
	PSA	N	N	3M, Tesa	3M, Tesa
	EMI Shielding	Silver/Carbon Ink /EMI Film	N	Silver/Carbon Ink /EMI Film	Silver/Carbon Ink /EMI Film
Layer Count	Standard	1-30	1-4	1-8	2-20
	Embeded	2-24	N	N	N
	HDI	4-30	N	4-8	4-20
Copper Weight	Max Copper Weight (IL)	Thru-hole: 10oz μVia Layer: Hoz (0.5oz)	N	2oz	2oz
Copper Weight	Max Copper Weight (OL)	Thru-hole: 10oz μVia Layer: 1oz	N	3oz	3oz
Mechanical Drill	Hole Type	thru-hole, blind via &buried via	thru-hole	thru-hole, blind via &buried via	thru-hole, blind via &buried via
	Hole Tolerance	NPTH: +/-0.05mm (2mil) PTH: +/-0.075mm (3mil)	NPTH: +/-0.05mm (2mil) PTH: +/-0.075mm (3mil)	NPTH: +/-0.05mm (2mil) PTH: +/-0.075mm (3mil)	NPTH: +/-0.05mm (2mil) PTH: +/-0.075mm (3mil)
	Press-Fit Hole Tolerance	+/-0.05mm (2mil)	N	N	+/-0.05mm (2mil)
	Min Hole Size	Mech 0.2mm (8mil)	Mech 0.3mm (12mil)	Mech 0.2mm (8mil)	Mech 0.2mm (8mil)
	PTH Tolerance	+/-0.075mm (3mil)	+/-0.075mm (3mil)	+/-0.075mm (3mil)	+/-0.075mm (3mil)
	PTH to PTH Space	0.2mm (8mil)	0.2mm (8mil)	0.25mm (10mil)	0.25mm (10mil)
	Min Annular Ring	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)
	Min BGA Pad Dia.	0.2mm (8mil)	N	0.2mm (8mil)	0.2mm (8mil)
	Min PTH to PCB Edge Space	0.25mm (10mil)	0.5mm (20mil)	0.2mm (8mil)	0.2mm (8mil)
	Min NPTH to PCB Edge Space	0.25mm (10mil)	0.5mm (20mil)	0.25mm (10mil)	0.25mm (10mil)
Laser Ablation	Microvia (μVia) Type	Blind &Buried Mircovia	N	Blind &Buried Mircovia	Blind &Buried Mircovia
	Microvia (μVia) Construction	Standard Microvia Staggered Microvia Stacked Microvia Skipped Microvia	N	Standard Microvia Staggered Microvia	Standard Microvia Staggered Microvia Stacked Microvia
	Microvia (μVia) Size	0.075mm (3mil) 0.1mm (4mil) 0.15mm (6mil)	N	0.075mm (3mil) 0.1mm (4mil) 0.15mm (6mil)	0.075mm (3mil) 0.1mm (4mil) 0.15mm (6mil)
	Capture Pad Size	μVia + 8mil, or 6mil	N	μVia + 8mil, or 6mil	μVia + 8mil, or 6mil
	Landing Pad Size	μVia + 8mil, or 6mil	N	μVia + 8mil, or 6mil	μVia + 8mil, or 6mil
	μVia to μVia Pitch	0.3mm (11.8mil)	N	0.3mm (11.8mil)	0.3mm (11.8mil)
	μVia to Buried Via Pitch	0.4mm (15.7mil)	N	0.4mm (15.7mil)	0.4mm (15.7mil)
	Laser Ablated PP	106, 1080	N	106, 1080	106, 1080
Via Process	IPC-4761 Type I Tented Vias	Y	N	Y	Y
	IPC-4761 Type II Tented and Covered Vias	Y	N	Y	Y
	IPC-4761 Type III Plugged Vias	Y	N	Y	Y
	IPC-4761 Type IV Plugged and Covered Vias	Y	N	Y	Y
	IPC-4761 Type V Filled Vias	Y	N	Y	Y
	IPC-4761 Type VI Filled and Covered Vias	Y	N	Y	Y
	IPC-4761 Type VII Filled and Capped Vias	Y	N	Y	Y
Trace	Initial Cu Hoz (IL)	3/3mil	3/3mil	3/3mil	3/3mil
	Initial Cu 1oz (IL)	3/4mil	3/4mil	3/4mil	3/4mil
	Initial Cu 2oz (IL)	4/5mil	4/5mil	4/5mil	4/5mil
	Initial Cu 3oz (IL)	5/8mil	N	N	N
	Initial Cu 4oz (IL)	6/11mil	N	N	N
	Initial Cu 5oz (IL)	7/14mil	N	N	N
	Initial Cu 6oz (IL)	8/16mil	N	N	N
	Initial Cu 7oz (IL)	9/19mil	N	N	N
	Initial Cu 8oz (IL)	10/22mil	N	N	N
	Initial Cu 9oz (IL)	11/25mil	N	N	N
	Initial Cu 10oz (IL)	12/28mil	N	N	N
	Initial Cu 1/3oz (OL)	3.5/4mil	N	3.5/4mil	3.5/4mil
	Initial Cu 1/2oz (OL)	3.9/4.1mil	N	3.9/4.1mil	3.9/4.1mil
	Initial Cu 1oz (OL)	4.8/5.5mil	4.8/5.5mil	4.8/5.5mil	4.8/5.5mil
	Initial Cu 2oz (OL)	6/8mil	6/8mil	6/8mil	6/8mil
	Initial Cu 3oz (OL)	6/12mil	N	6/12mil	6/12mil
	Initial Cu 4oz (OL)	7.5/15mil	N	N	N
	Initial Cu 5oz (OL)	9/18mil	N	N	N
	Initial Cu 6oz (OL)	10/21mil	N	N	N
	Initial Cu 7oz (OL)	11/25mil	N	N	N
	Initial Cu 8oz (OL)	12/29mil	N	N	N
	Initial Cu 9oz (OL)	13/33mil	N	N	N
	Initial Cu 10oz (OL)	14/38mil	N	N	N
Pad to Hole Distance	Component Holes	Drilled Size + 0.15mm (6mil)	Drilled Size + 0.15mm (6mil)	Drilled Size + 0.15mm (6mil)	Drilled Size + 0.15mm (6mil)
Pad to Hole Distance	Via Holes	Drilled Size + 0.15mm (6mil)	Drilled Size + 0.15mm (6mil)	Drilled Size + 0.15mm (6mil)	Drilled Size + 0.15mm (6mil)
Pad to Laser Microvia Space	Min Space	Ablated Size + 0.1mm (4mil)	N	Ablated Size + 0.1mm (4mil)	Ablated Size + 0.1mm (4mil)
Pad to Laser Microvia Space	Standard	Ablated Size + 0.2mm (8mil)	N	Ablated Size + 0.2mm (8mil)	Ablated Size + 0.2mm (8mil)
Via-in-Pad (VIPPO)	Non-Conductive Epoxy Filled	Y	N	Y	Y
	Min Epoxy Filled Thru-Hole Size	0.1mm (4mil)	N	0.1mm (4mil)	0.1mm (4mil)
	Max Epoxy Filled Thru-Hole Size	1mm (39.37mil)	N	1mm (39.37mil)	1mm (39.37mil)
	Copper Plated Over	Y	N	Y	Y
	Min Copper Plated μVia Size	0.1mm (4mil)	N	0.1mm (4mil)	0.1mm (4mil)
	Max Copper Plated μVia Size	0.15mm (6mil)	N	0.15mm (6mil)	0.15mm (6mil)
Blind &Buried Vias	Sequential Lamination	<=3 Lamination Cycles	N	<=2 Lamination Cycles	<=3 Lamination Cycles
	Max Epoxy Filled Via Size	0.15mm (6mil)	N	0.15mm (6mil)	0.15mm (6mil)
	Min Epoxy Filled Via Size	0.1mm (4mil)	N	0.1mm (4mil)	0.1mm (4mil)
	Max Aspect Ratio of Epoxy Filled Via	10:1	N	10:1	10:1
	Epoxy Filled Material	Non- and Conductive	N	Non- and Conductive	Non- and Conductive
Back Drilling	Back Drill	PTH + 0.25mm (10mil) Dia.	N	N	PTH + 0.25mm (10mil) Dia.
	Min Backside Dielectric Separation	+/-0.1mm (4mil)	N	N	+/-0.1mm (4mil)
	Edge Milling Available	Y	N	N	Y
	Min Back Drill Dia.	0.35mm (13.8mil)	N	N	0.35mm (13.8mil)
	Drilled Hole Over Finished Hole Size	0.25mm (10mil)	N	N	0.25mm (10mil)
	Drill Depth Tolerance	+/-0.13mm (5mil)	N	N	+/-0.13mm (5mil)
Solder Mask	Min S/M Clearance	0.075mm (3mil)/side	0.075mm (3mil)/side	0.075mm (3mil)/side	0.075mm (3mil)/side
	Min S/M Dam	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)
	S/M Thickness	>=10μm (0.4mil)	>=10μm (0.4mil)	>=10μm (0.4mil)	>=10μm (0.4mil)
	Min S/M Height	0.8mm (31.5mil)	0.8mm (31.5mil)	0.8mm (31.5mil)	0.8mm (31.5mil)
	Min S/M Width	0.15mm (6mil)	0.15mm (6mil)	0.15mm (6mil)	0.15mm (6mil)
	Pad Size Larger than NPTH	013mm (5mil)/side	013mm (5mil)/side	013mm (5mil)/side	013mm (5mil)/side
	Web between SMD Part Pads	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)
	Min S/M Defined (SMD) Pad Dia.	0.13mm (5mil)	0.13mm (5mil)	0.13mm (5mil)	0.13mm (5mil)
	S/M Harness	>=6H	>=6H	>=6H	>=6H
	S/M Registration Tolerance	+/-0.075mm (3mil)	+/-0.075mm (3mil)	+/-0.075mm (3mil)	+/-0.075mm (3mil)
	S/M Color	Green, Matte Green, Blue, Red, Black, Matte Black, Yellow, White, Matte White	Green, Matte Green, Blue, Red, Black, Matte Black, Yellow, White, Matte White	Green, Matte Green, Blue, Red, Black, Matte Black, Yellow, White, Matte White	Green, Matte Green, Blue, Red, Black, Matte Black, Yellow, White, Matte White
	S/M Plugged Vias	Y	N	Y	Y
Coverlay	Coverlay Color	N	N	Yellow, white, black	Yellow, white, black
	Min WO (Mech Drilling)	N	N	0.4mm (15.7mil)	0.4mm (15.7mil)
	Min Square WO (SDR)	N	N	0.6×0.6mm (23.6×23.6mil)	0.6×0.6mm (23.6×23.6mil)
	Min Square WO (Die Punching)	N	N	0.5×0.5mm (19.7×19.7mil)	0.5×0.5mm (19.7×19.7mil)
	Min WO Space (Mech Drilling)	N	N	0.15mm (6mil)	0.15mm (6mil)
	Min WO Space (Laser Drilling)	N	N	0.1mm (4mil)	0.1mm (4mil)
	Min WO to Pad Space	N	N	0.1mm (4mil)	0.1mm (4mil)
	Min WO to Trace Space	N	N	0.1mm (4mil)	0.1mm (4mil)
	Coverlay Registration Tolerance	N	N	0.15mm (6mil)	0.15mm (6mil)
Silkscreen	Min Stroke/Width (Printed Legend)	0.13mm (5mil)	0.13mm (5mil)	0.13mm (5mil)	0.13mm (5mil)
	Min Legend Width	0.125mm (4.92mil)	0.125mm (4.92mil)	0.125mm (4.92mil)	0.125mm (4.92mil)
	Min Legend Height	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)	0.1mm (4mil)
	Min Legend to Pad Space	0.15mm (6mil)	0.15mm (6mil)	0.15mm (6mil)	0.15mm (6mil)
	LPI Legend Available	Y	Y	Y	Y
	LPI Legend Min Stroke/Width	0.05mm (2mil)	0.05mm (2mil)	0.05mm (2mil)	0.05mm (2mil)
	Silkscreened/LPI Color	White, Black, Yellow, Red, Blue	White, Black, Yellow, Red, Blue	White, Black, Yellow, Red, Blue	White, Black, Yellow, Red, Blue
Surface Finish	HASL (lead-free, with lead)	Y	Y	N	N
	OSP	Y	Y	Y	Y
	ENIG	Y	Y	Y	Y
	Hard Gold Plating	Y	Y	Y	Y
	Soft Gold Plating	Y	Y	Y	Y
	Gold Finger Plating	Y	N	Y	Y
	ENEPIG	Y	Y	Y	Y
	ENIG + OSP	Y	Y	Y	Y
Edge Connector Bevelling	Finger Tip Angle	15°, 30°, 45°, 60°	N	N	15°, 30°, 45°, 60°
Edge Connector Bevelling	Bevelling Depth Tolerance	+/-0.13mm (5mil)	N	N	+/-0.13mm (5mil)
Profile	V-Scoring Angles	30°(preferred), 45°, 60°	N	30°(preferred), 45°, 60°	30°(preferred), 45°, 60°
	V-Scoring Offset Tolerance	+/-0.13mm (5mil)	+/-0.13mm (5mil)	N	+/-0.13mm (5mil)
	V-Scoring Remaining Web Thickness	1/3 of PCB Thickness	1/3 of PCB Thickness	N	1/3 of PCB Thickness
	V-Scoring Position Tolerance	+/-0.13mm (5mil)	+/-0.13mm (5mil)	N	+/-0.13mm (5mil)
	Min Milling Tool Size	0.5mm (19.7mil)	0.5mm (19.7mil)	N	0.5mm (19.7mil)
	Milling Tolerance	+/-0.13mm (5mil)	+/-0.13mm (5mil)	N	+/-0.13mm (5mil)
	Min Milling Inner Radius	0.25mm (10mil)	0.25mm (10mil)	N	0.25mm (10mil)
	Min Milling to Trace Space	0.2mm (8mil)	0.2mm (8mil)	N	0.2mm (8mil)
	Laser Profiling	N	N	Y	Y
	Die Punch Profiling	Y	Y	Y	Y
E-test	E-test Tool	Flying Probe, Fixture	Flying Probe, Fixture	Flying Probe, Fixture	Flying Probe, Fixture
E-test	E-test Rate	100%	100%	100%	100%
Special Features	Heavy Copper	Y	Y	Y	Y
	Edge Castellation	Y	N	Y	Y
	Edge Plating	Y	N	Y	Y
	Heatsinks	Y	Y	N	N
	Backplane	Y	N	N	N
	Buried Chips and Resistors	Y	N	N	N
	Sheet Resistance	Y	N	Y	Y
	Constantan Hybrid Construction	Y	N	Y	Y
	Peelable Protective Tape	Y	Y	Y	Y
	SMD Stencil	Y	Y	Y	Y
Data	Film Date Format	DXF, RS-274-X, RS-274 D, ODB++	DXF, RS-274-X, RS-274 D, ODB++	DXF, RS-274-X, RS-274 D, ODB++	DXF, RS-274-X, RS-274 D, ODB++
	Drill Data Format	ASCII, Excellon Format RS-274-X, RS-274-D	ASCII, Excellon Format RS-274-X, RS-274-D	ASCII, Excellon Format RS-274-X, RS-274-D	ASCII, Excellon Format RS-274-X, RS-274-D
	Electrical Test Format	IPC-D356	IPC-D356	IPC-D356	IPC-D356
	Netlist Check Format	IPC-D356, IPC-356A	IPC-D356, IPC-356A	IPC-D356, IPC-356A	IPC-D356, IPC-356A
	Compression Format	ZIP, TAR, TGZ	ZIP, TAR, TGZ	ZIP, TAR, TGZ	ZIP, TAR, TGZ

MADPCB is a professional PCB manufacturer with advanced PCB capabilities. We keep pace on the cutting-edge PCB fabrication technologies to meet your needs with any complexities. We focus on manufacturing multilayer board, HDI PCB, high frequency circuit board, embedded passives PCB, and providing high quality and affordable price of printed circuit boards to our customers.