CBGA

What’s Ceramic BGA?

 

Ceramic Ball Grid Array (CBGA) is a square-shaped or rectangular ceramic package that uses solder balls for external electrical connection instead of leads. These solder balls are arranged in a grid or array at the bottom of the ceramic package body, hence the name “ceramic ball grid array”. Actually, the DBGA is just one of several types of the BGA package.

 

 

Typical Ceramic BGAs have ball counts that range from 9 to 324, although it’s with more balls do exist. In fact, the new and smaller CBGA version known as the μCBGA can come with more than a thousand solder balls.

Ball pitch (distance between solder balls) values typically used by the Ceramic BGA package are 0.8mm and 1.0mm, while a μCBGA commonly uses a ball pitch of 0.4mm. Solder ball arrangement patterns used by the Ceramic BGA can be one of these three: perimeter, staggered, or full grid array. Typical Ceramic BGA body sizes range from 4mm square to 35mm square.

Properties of Some CBGAs
Package	No. of Balls	Body Size	Body Thickness	Ball Pitch
14-CBGA	14	4.5 mm x 7.0 mm	1.04 mm	1.0 mm
32-CBGA	32	6.85 mm x 6.85 mm	2.9 mm	0.8 mm
100-CBGA	100	9 mm x 9 mm	1.2 mm	0.8 mm
64-μCBGA	64	4 mm x 4 mm	1 mm	0.4 mm
132-μCBGA	132	6 mm x 6 mm	1 mm	0.4 mm