CPGA

What’s CPGA Package?

 

The Ceramic Pin Grid Array (CPGA) is a square or rectangular through-hole ceramic package whose pins or leads are arranged in a square array at the bottom of the package body. The Ceramic PGA can either have a frit-sealed ceramic lid or a solder-sealed metal lid.

 

The CPGA is just one of several types of the PGA package. The PGA is a popular choice for devices with high I/O counts, such as microprocessor because of its high pin density.

Typical CPGA’s have pin counts that range from 28 to 476, although CPGA’s with more pins do exist. The pins in a CPGA are usually spaced 100mil (approx. 2.54mm) apart. Note that the rows of pins in some high-density CPGA’s are arranged on a staggered basis, i.e., a row is offset by 1.27mm (1/2 of the lead pitch) with respect to its adjacent rows.

The CPGA can either be directly soldered onto a through-hole PCB or used with a PGA socket.

Properties of Some CPGAs
No. of Pins	Body Size	Body Thickness	Pad Pitch
28	14.0 x 16.5 mm	2.5 mm	2.54 mm
36	19.3 x 19.3 mm	2.8 mm	2.54 mm
44	20.3 x 20.3 mm	2.4 mm	2.54 mm
84	27.9 x 27.9 mm	2.4 mm	2.54 mm
132	34.5 x 34.5 mm	2.5 mm	2.54 mm
257	50 x 50 mm	2.7 mm	2.54 mm