DSOP Advance, a Thermally Enhanced Double Side Cooling Package, which improved the efficiency of power supply for high-current applications.
DSOP Advance has a metallic plate (E-Pad) on the top of the packaging to dissipate heat from the chips. Improved heat dissipation through this metallic plate reduces the increase in MOSFET temperatures during high-current conduction and contributes to improved power density and efficiency of power supply circuits. Thermal resistivity Rth(ch-c) of it is reduced by 45% compared with SOP Advance of the same package size. Since the footprint patterns are the same as those of the conventional SOP Advance, they can be replaced without changing the layout of the printed circuit board (PCB).