Flow Soldering is also called Wave Soldering. Flow Soldering is a bulk PCB assembly process used in printed circuit boards manufacturing. The circuit board is passed over a pan of molten solder, in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components.
As through-hole components have been largely replaced by surface mount components, wave soldering has been supplanted by reflow soldering methods in many large-scale electronics applications. However, there is still significant wave soldering where surface-mount technology (SMT) is not suitable (e.g., large power devices and high pin count connectors), or where simple through-hole technology prevails (certain major appliances).
The height of the solder wave is a key parameter that needs to be evaluated when setting up the wave solder process. The contact time between the solder wave and assembly being soldered is typically set to between 2 and 4 seconds. This contact time is controlled by two parameters on the machine, conveyor speed and wave height, changes to either of these parameters will result in a change in contact time. The wave height is typically controlled by increasing or decreasing the pump speed on the machine. Changes can be evaluated and checked using a tempered glass plate, if more detailed recording are required fixture are available which digitally record the contact times, height and speed.