Electronic Glossary

The number of holes per unit area on a PCB.

Home base apertures are the shape of the aperture used in laser cut stencils that will control solder balling and tomb-stoning of chip components.

What Is Hot Spot in SMT Assembly?   A Hot Spot is an area that gets too much heat and results in warped, blistered or even burnt boards. Generally, this is caused by large areas of copper (Copper Pour) in …

The insulating body, usually a plastic moulding which holds the electrical contacts. Housings are also referred to as insulators, dielectrics or shells. See Enclosure.

HSOP is Thermally-enhanced small-outline package, also known as Thermally-enhanced SOP.

What’s HSSOP Package?   Thermally-enhanced Shrink Small-Outline Package (HSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. This package has an exposed pad on the bottom side. The digital PWM topology of the device provides …

HTSSOP means Thermally-enhanced thin shrink small-outline package, also known as Thermally-enhanced shrink SOP. HTSSOP is Texas Instruments name for a TSSOP with an exposed pad on the bottom side. There are some other manufacturers who uses the same name.

Heat-sink very-thin quad flat-pack, no-leads

A generic term for a range of technologies which integrate passive and active components. Most commonly refers to ceramic substrates patterned with precious metal interconnect and resistor materials, on which chip ceramic capacitors and integrated circuits are soldered, resin bonded …

In computing, Input/Output or I/O (or, informally, io or IO) is the communication between an information processing system, such as a computer, and the outside world, possibly a human or another information processing system. Inputs are the signals or data …