Solderability Test: All you need to know The evaluation of a metal to determine its ability to be wetted by solder according to 202, Method 208; MIL-STD 883, Method 2003.10; IPC-TM-650, Method 2.4.12 Solderability test. The Solderability test method provides …
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Electronic Glossary
Soldering
The process of joining metal surfaces with solder without melting the original metals.
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Solids Content
The weight percentage of rosin (solids) in a flux formula.
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SON
What’s SON Package? Small-outline no-lead package (SON), also known as Flat no-leads, and micro leadframe (MLF). Flat no-leads packages, such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards (PCBs). …
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SOP
Small Outline Package (SOP) is a type of surface mount IC package. See Chip Package, IC, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP and VSOP. Turnkey PCB assembly with components sourcing service at MADPCB.
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SOT
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, also manufacturers offer the nearly identical thin small outline transistor (TSOT) package, where …
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SOT-23
What Is SOT-23 Package? The most common SOT are SOT-23 variations. The SOT23-3 package is very popular and a common package for transistors, and is also used for diodes and voltage regulators. Small Outline Transistor (SOT) packages are very small, inexpensive …
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Space Transformer
A major component of certain high-density probe cards. It provides pitch reduction, high routing density and localized mid-frequency decoupling. A major developer of ATE systems which use space transformers is Wentworth Labs.
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