What’s PSON Package?
Plastic Small-outline No-lead (PSON) package is a SON package with a plastic small outline and no lead, with no lead extending beyond the package body. The contact pads are exposed and flush with the bottom of the package.
Plastic Small-outline No-lead (PSON)
- Small footprint (yields savings in PCB space)
- Thin package (< 1mm package height)
- Excellent thermal performance (Soldering the exposed thermal paddle to the board provides an excellent path for heat transfer from die to the board)
- Smaller size, form factor, and location of contact pads allows parts to be placed closer to the other components on the board
- Negligible package lead inductance
- Uses standard surface mount equipment and flow for PCB assembly
- There are no lead co-planarity issues with this package