SBGA (Super BGA) package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heatsink. Since the IC and the I/O are on the same side, signal vias are eliminated. The dummy die enables the Practical Dummy Component to have the same characteristics as the live component.
| SBGA 1.27mm Pitch | ||||||
| Part Description | I/O Count | Pitch | Body Size | Ball Matrix | Ball Alignment | Qty Per Tray |
| A-SBGA256-1.27mm-27mm | 256 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| A-SBGA304-1.27mm-31mm | 304 | 1.27mm | 31mm | 23 x 23 | Perimeter | 27 |
| A-SBGA352-1.27mm-35mm | 352 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| A-SBGA432-1.27mm-40mm | 432 | 1.27mm | 40mm | 31 x 31 | Perimeter | 21 |
| A-SBGA520-1.27mm-40mm | 520 | 1.27mm | 40mm | 31 x 31 | Perimeter | 21 |
| A-SBGA560-1.27mm-42.5mm | 560 | 1.27mm | 42.5mm | 33 x 33 | Perimeter | 12 |
| A-SBGA600-1.27mm-45mm | 600 | 1.27mm | 45mm | 35 x 35 | Perimeter | 12 |
Notes:
- Superior thermal performance.
- Light weight
- Low profile (1.4mm mounted)
- Moisture resistant (JEDEC level 3)
- JEDEC MO-192 standard outlines
- Enhanced electrical performance > 1 GHz
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.
- Parts can be baked and dry-packed.
- All components are daisy-chained except for 520 I/O.
- Lead-free parts are available with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also available (call for availability).
- SBGAs are not available without solder balls.