The fabrication of a multilayer PCB requires several lamination sequences. Especially multiple buried vias in high density interconnect (HDI) boards require the Sequential Build Up (SBU) technology.
When making a PCB with buried vias, firstly we need to prepare the innerlayers (as a “Core“) that need to be copper plated. In a next “sequence” extra layers are added which need another thru-hole plating. These “sequences” can be repeated several times.
SBU technology has overcome the cost issues associated with small hole drilling and sequential lamination. Furthermore, the technology holds promise in reducing layer count and board size and allows greater packaging efficiency.
