What’s TFBGA Package?
Thin Profile Fine-Pitch Ball Grid Array (TFBGA) is a thinner version of the FBGA package. Like all BGA packages, thin profile fine pitch BGAs use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. It is near-chip-scale in size and features ball pitch values that are even tighter than those of the FBGA.
Thin-Profile Fine-Pitch Ball Grid Array (TFBGA)
Typical thin profile BGAs have ball counts that range from 16 to 384 solder balls. The typical ball pitch is 0.5 mm to 0.8 mm. The typical package thickness is greater than 1 mm but not more than 1.2 mm.
| Properties of Some TFBGAs | |||
| No. of Balls | Body Size | Package Height (incl. solder balls) |
Ball Pitch |
| 16 | 3 mm x 3 mm | 1.2 mm | 0.5 mm |
| 48 | 7 mm x 7 mm | 1.2 mm | 0.75 mm |
| 64 | 7 mm x 7 mm | 1.1 mm | 0.5 mm |
| 72 | 5 mm x 5 mm | 1.2 mm | 0.5 mm |
| 121 | 6 mm x 6 mm | 1.2 mm | 0.5 mm |
| 152 | 14 mm x 14 mm | 1.1 mm | 0.65 mm |
| 196 | 8 mm x 8 mm | 1.2 mm | 0.5 mm |
| 324 | 15 mm x 15 mm | 1.2 mm | 0.8 mm |