What’s UTDFN Package?
Ultra Thin Dual Flat No-lead (UTDFN) package is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads along two sides of the package body for electrical connection to the outside world. It is basically a thinner version of the thin dual flat no-lead (TDFN) package.
Ultra Thin Dual Flat No-lead (UTDFN)
Typical pad counts range from 6 to 14. The body thickness typically ranges from 0.40 mm to 0.55 mm. The pad pitch (distance between pads) used is usually either 0.4 mm or 0.5 mm.
| Properties of Some UTDFNs | |||
| No. of Pads | Body Size | Body Thickness | Pad Pitch |
| 6 | 1 x 1.2mm | 0.50mm | 0.4mm |
| 6 | 3 x 3mm | 0.55mm | 0.5mm |
| 8 | 2 x 2mm | 0.55mm | 0.45mm |
| 10 | 3 x 3mm | 0.55mm | 0.5mm |
| 14 | 3 x 4mm | 0.55mm | 0.5mm |