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- 4-Layer HDI Rigid-Flex Board with Blind Microvias
4-Layer HDI Rigid-Flex Board with Blind Microvias
- Layer Count: 4 layers
- Structure: 2 Flex + 2 Rigid
- Material: (see stack-up) 94V-0, RoHS
- FPC Thickness: 0.18mm+/-0.03mm
- Rigid-Flex PCB Thickness: 0.5mm +/-0.15mm
- Solder Mask: Green x2
- Coverlay: yellow x2
- Silkscreen: white x1
- Unit Size: 170 x 72mm
- Panel Size: 190 x 100mm/1up
- Finished Copper Weight: 28/15/15/28μm
- Surface Finish: ENIG (Au: 2-3μ”, Ni: 120-240μ”)
- Laser Ablated Dia.: 0.1mm
- Blind μVia: L1-L2
- Via-in-Pad: Yes