4-Layer HDI Rigid-Flex Board with Blind Microvias

  • Layer Count: 4 layers
  • Structure: 2 Flex + 2 Rigid
  • Material: (see stack-up) 94V-0, RoHS
  • FPC Thickness: 0.18mm+/-0.03mm
  • Rigid-Flex PCB Thickness: 0.5mm +/-0.15mm
  • Solder Mask: Green x2
  • Coverlay: yellow x2
  • Silkscreen: white x1
  • Unit Size: 170 x 72mm
  • Panel Size: 190 x 100mm/1up
  • Finished Copper Weight: 28/15/15/28μm
  • Surface Finish: ENIG (Au: 2-3μ”, Ni: 120-240μ”)
  • Laser Ablated Dia.: 0.1mm
  • Blind μVia: L1-L2
  • Via-in-Pad: Yes