6 Layer FR4 PCB with Via-in-Pad and Gold Fingers

Layer Count：6 layers
HDI Level: 1+4+1
Material：FR-4 Tg170, 94V-0
Finished Board Thickness: 1.6mm +/-10%
Solder Mask: Green x2
Silkscreen: White x2
Unit Size: 75.21×135.45mm
Panel Size：95×143.48mm/4up
Finished Inner Copper Weight: 1oz
Finished Outer Copper Weight: 1oz
Surface Finish: ENIG (Au: 2-3μ”, Ni: 120-240μ”)
Gold Finger: Hard Gold (Au: 30-50μ”, Ni: 120-240μ”), 45° beveling
Via-in-Pad: Fully filled and capped according IPC-4761 Type VII
Controlled Impedance: Diff. 100ohm±10%, Trace W/S=8/7mil