8 Layer 1+6+1 HDI PCB with Blind Microvias

Layer Count: 8 Layers
HDI Level: 1+6+1
Material: FR4 Tg150, 94V-0
Finished Board Thickness: 1.2mm +/-10%
Solder Mask: Green x2
Silkscreen: White x2
Unit Size: 94.89*90.17mm
Panel Size: N/A
Finished Inner Copper Weight: 0.5oz
Finished Outer Copper Weight: 1oz
Surface Finish: ENIG (Au: 2-3μ”)
BGA Pitch: 0.35mm
Blind Microvias on BGA requires resin filled and copper capped