8-Layer Rigid-Flex PCB Manufacturing

  • Layer Count: 8 layers
  • Structure: 2 Flex + 6 Rigid
  • Material: FR-4 Tg150, 50μm PI + 18μm Cu Double-sided FCCL, 94V-0, RoHS
  • FPC Thickness: 0.22mm+/-0.03mm
  • Rigid-Flex PCB Thickness: 1.6mm +/-10%
  • Solder Mask: Green x2
  • Coverlay: yellow x2
  • Silkscreen: no
  • Unit Size: 285 x 100mm
  • Panel Size: 305 x 120mm/1up
  • Finished Inner Copper Weight: 0.5oz
  • Finished Outer Copper Weight: 1oz
  • Surface Finish: ENIG (Au: 2-3μ”, Ni: 120-240μ”)
  • BGA Layout: Dog-bone fan-out
  • Impedance Control: Diff. 90ohm+/-10% and 100ohm±10%