12-Layer Camera Module PCB Board with Mechanical Blind Vias

  • Layer Count: 12 layers
  • Material: FR-4 Tg170, 94V-0, RoHS
  • Finished Board Thickness: 1.8mm +/-10%
  • Solder Mask: Green x2
  • Silkscreen: White x2
  • Unit Size: 22.9*22.9mm
  • Panel Size: 60.2*60.2mm/4up (2×2) (1A+1B+1C+1D)
  • Finished Inner Copper Weight: 35μm
  • Finished Outer Copper Weight: 50.8μm
  • Surface Finish: ENIG (Au: 2-3μ”, Ni: 120-240μ”)
  • Controlled Impedance: Yes
  • Mechanical Blind Vias: yes