Staggered Microvias and Stacked Microvias PCB in HDI PCB

HDI printed circuit board (PCB)  layers are piled up one by one using laser technology and plating technology after forming a conductor pattern on an insulating layer. Because wiring is possible on the connection part of each layer, this method achieves higher density and higher integration than ordinary multi-layer PCBs.  So here you will learn about Staggered Microvias and Stacked Microvias PCB in HDI PCB. They are used for devices that require high-density wiring in a limited space.

Here are all about microvia I and microvia II in HDI PCBs using stacked microvias and staggered microvias.

Features of Staggered Microvias

• HDI PCBs with Staggered Microvia and Stacked Microvia
• Any combination with Laser Via, IVH or Plated Through Hole is possible

Applications of Staggered Microvias

• Cellular Phones
• Small Mobile Devices
• Car Navigation Systems
• Digital Cameras
• Digital Video Cameras
• Multi-functional Printers

 

Cross-Sections

 

Stack-ups

 

Design Rules

Parameter			Symbol	Standard Spec	Min Spec
Trace Width/Spacing	HDI Layer		A/A’	75/75	50/50
	Core Layer		B/B’	75/75	50/50
Plated Through Hole	Drill Diameter		C	300	250
	Pad Diameter	Outer Layer	D	550	450
		Inner Layer	E	600	500
IVH (Inner Via Hole)	Drill Diameter		F	250	200
	Pad Diameter	Outer Layer	G	500	400
		Inner Layer	H	500	450
Laser Via	Via Diameter		I	100	75
	Pad Diameter		J	250	220
Dielectric Thickness	HDI Layer		K	60	40
	Core Layer		L	100	60

* These figures are merely settings. They are subject to change without notice.

 

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