CERamic QUAD, or CERQUAD, is a square, ceramic, surface mount chip package. It uses a ceramic lid that is bonded to the chip with a glass seal. It has pins on all four sides that wrap under like those of a PLCC package. See CERDIP, CDIP and PLCC.
Ceramic QFP packages come in two variants, CERQUAD and CQFP. The leadframe of CERQUAD is attached between two ceramic layers of the package. The leadframe is attached using glass. This package is a variant of the CERDIP package. CERQUAD packages are the “low cost” alternative for CQFP packages, and are mainly used for terrestrial applications. Main ceramic package manufacturers are Kyocera, NTK,… and offer the full pincount range.