What’s CQFP Package?
Ceramic Quad Flat Pack (CQFP) is a ceramic IC package with leads extending from all four sides of the package body. CQFP’s are predominantly square in shape, although rectangular variants do exist.
The CQFP is just one of the many types of the quad flat pack (QFP) package. The ceramic QFP comes in many body sizes, with lead counts typically ranging from 28 to 352. Lead pitch values used by CQFP’s range from 0.5 mm to 1.27 mm. Typical Ceramic QFP body thickness varies from 1.27 mm to 4 mm.
Properties of Some CQFPs | |||
No. of Pins | Body Size | Body Thickness (incl. heat slug) |
Lead Pitch |
24 | 10.16 x 10.16 mm | 1.78 mm | 1.27 mm |
48 | 11.5 x 11.5 mm | 2.64 mm | 0.635 mm |
184 | 31 x 31 mm | 3.5 mm | 0.65 mm |
240 | 32 x 32 mm | 3.25 mm | 0.50 mm |
308 | 76.2 x 76.2 mm | 3.80 mm | 0.635 mm |
Notes
- CQFPs are available with or without combo lid.
- Pins are flat (sandwiched) with tie bar.
- Parts are packaged in non-JEDEC trays.
- Due to the custom nature of the package, body size and dimensions can change without notice.
- Parts available with a daisy-chain configuration upon request.
- Other ceramic packages available upon request.
- Glass or epoxy seal.
- Footprint compatible with plastic QFP packages.
- EIAJ and JEDEC standards.
- Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.
See QFP, LQFP, PQFP, and TQFP. Make your turnkey PCB assembly with components sourcing service at MADPCB.