What’s HSSOP Package?
Thermally-enhanced Shrink Small-Outline Package (HSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.
This package has an exposed pad on the bottom side. The digital PWM topology of the device provides dramatic improvements in efficiency over traditional linear amplifier solutions. This reduces the power dissipated by the amplifier by a factor ten under typical music payback conditions. The device incorporates all the functionality needed to perform in the demanding OEM applications. They have built-in load diagnostic functions for detecting and diagnosing misconnected outputs to help to reduce test time during the manufacturing process.
HSSOP (Thermally-enhanced Shrink Small-Outline Package)