What’s LGA Package?
The Land Grid Array (LGA) is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array -PGA) or solder balls (as in the ball grid array -BGA). The molded area array matrix package which can be used in a socket or connected to the board using solder paste. These metal pads, which are called “lands”, are arranged in a grid or array at the bottom of the package body, hence the name “land grid array”. The grid arrangement of the lands of the LGA package allows it to have a high land count, making it a popular packaging option for device with high I/O requirements. An LGA chip has flat pads on the bottom of its package that touch contacts on the motherboard socket.
Land Grid Array (LGA)
Typical LGAs have land counts that range from 8 to 1681. LGA with the lowest land counts are basically QFN’s since the lands of these packages just occupy the periphery of the body. Land pitch (distance between lands) values typically used by the LGA range from 1.0mm to 1.27mm.
| No. of Lands |
Body Size | Body Thickness | Land Pitch |
| 10 | 5 x 3 mm | 1.49 mm | 1.27 mm |
| 21 | 6.25 x 6.25 mm | 2.32 mm | 1.27 mm |
| 35 | 11.25 x 6.25 mm | 2.82 mm | 1.27 mm |
| 56 | 11.25 x 9 mm | 2.82 mm | 1.27 mm |
| 84 | 15 x 9 mm | 4.32 mm | 1.27 mm |
| 104 | 15 x 15 mm | 2.82 mm | 1.27 mm |
| 144 | 15 x 15 mm | 4.32 mm | 1.27 mm |
| 204 | 22 x 15 mm | 4.32 mm | 1.27 mm |