mini-SOIC: Very-Thin Shrink Small-outline Package (VSSOP)

From the cross reference of National Semiconductor (NSC) package type names of Texas Instruments (TI) Industry Standard Terms for package types and package families. Mini-SOIC is very-thin shrink small-outline package (VSSOP), which is another small outline IC (SOIC) variant, available only for 8-pin and 10-pin ICs, also called micro-SOIC. This case is much smaller, with a pitch of only 0.5mm. Mini-SOIC is an excellent overview of different semiconductor packages is provided by National Semiconductor.

See the following table for the 10-pin model.

Package	W_B	W_L	H	C	L	P	L_L	T	L_W
MiniSOIC-10	3	4.9	1.09	0.1	3	0.5	0.95	0.19	0.23

Mini-SOIC package occupies an area about 30-50% less than an equivalent dual-inline package (DIP), with a typical thickness being 70% less. The ICs are generally available in the same pin-outs as their counterpart DIP ICs. The conventional for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin would be housed in an SOIC-14 or SO-14 package.