What’s MQFP?

 

Metric Quad Flat Pack (MQFP) is a surface-mount IC package with gull wing leads on all four sides of the package body. This package is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. It is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the package provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs.

Metric Quad Flat Pack (MQFP)

Metric Quad Flat Pack (MQFP)

 

MQFP-d is a thermally enhanced version. Thermal enhancement is achieved by an embedded anodized aluminum heat spreader which is dropped in during the mold process. This process allows the use of a standard leadframe while offering an added margin of thermal performance for high power applications. This enhanced package offers 30% improvement (typical) in thermal performance over standard packages. Here is the comparison between these two packages.

MQFP vs. MQFP-d

MQFP vs. MQFP-d

 

 

Features

 

  • Body Sizes: 10 x 10mm to 28 x 28mm (from 10mm2 to 40mm2)
  • Package Thickness: 2.0mm to 3.5mm
  • Lead Counts: 44 to 304
  • Lead Pitch: 0.80mm to 0.50mm
  • Available in gold or copper wirebond versions
  • Limited number of open tool leadframe and die pad sizes available
  • Moisture Sensitivity: JEDEC Level 3
  • JEDEC standard compliant
  • Lead-free, Green and Low Alpha materials sets available

 

Properties of Some Examples
Part Number No.
of Pins
Body
Size
Body
Thickness
Lead
Pitch
MQFP-44 44 10 x 10mm 2mm 0.8mm
MQFP-52 52 14 x 14mm 2mm 0.8mm
MQFP-120 120 28 x 28mm 3.5mm 0.8mm
MQFP-208 208 28 x 28mm 3.5mm 0.5mm
MQFP-240 240 32 x 32mm 3.2mm 0.5mm

 

Applications

ASIC
DSP
• Gate Array
Logic / Microprocessors / Controllers
• Multimedia and PC Chipsets
• 3D graphics, telecom, wireless, audio, CPU

 

Metric QFP allows IC packaging engineers and systems designers the flexibility of growing or shrinking IC package size based upon application need. Complete lines of Metric Quad Flat Pack packages from IC manufacturers is available to provide security, convenience and success. The lines are adapted to meet the increasing challenges of advanced Digital Signal Processors (DSP), microcontrollers, ASIC, gate arrays (FPGA/PLD), and other technologies. These packages fill application needs in commercial, automotive, industrial and other product areas.