Electronic Glossary

Transmission line in which the signal carrying conductor is covered by a dielectric and another conductor.

Chip on Board (COB) technology -Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black epoxy. Also used for LEDs. In LEDs, transparent epoxy or a silicon …

What’s COF?   COF (Chip on Flex) is a display packaging technology, and is also a variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with …

COG (Chip on Glass) is a display packaging technology, and COG is also a variation of TAB, where a IC chip is mounted directly onto the ledge of a piece of glass – typically an liquid crystal display (LCD), sometimes …

What Is Cold Spot in PCB Assembly?   SMT Cold Spot is an area that does not get sufficient heat from reflow oven to activate the flux at the right time and allow the solder to reach molten stage and …

The semiconductor region in a bipolar junction transistor (BJT) through which a flow of charge carriers leaves the base region.

Set of colors used to indicate value of a component.

A multi-segment light emitting diode (LED) with a single negative voltage input connection. Separate anode connections are provided for each individual segment.

A multi-segment light emitting diode (LED) with a single positive voltage input connection. Separate cathode connections are provided for each individual segment.

An op-amp circuit that compares two inputs and provides a DC output indicating the polarity relationship between the inputs.