Fan-In Wafer-Level Package (FI-WLP) Fan-In Wafer-Level Package (FI-WLP) refers to the technology of packaging an integrated circuit (IC) at the wafer level, instead of the traditional process of assembling individual dies into packages after dicing them from a wafer. …
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Electronic Glossary
Fiberglass
PCB Fiberglass, or Fiber Glass within the PCB CCL and PP is constructed by weaving fibers of glass yarn together to form fabric-like fiberglass sheets. These sheets are then impregnated with an epoxy resin to form the core (cured resin) and …
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Filter
What’s a Filter? A Filter is a circuit capable of passing (or amplifying) certain frequencies while attenuating other frequencies. Thus, a filter can extract important frequencies from signals that also contain undesirable or irrelevant frequencies. In the field of …
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Fine Line
IPC has no specific definition for a Fine Line in printed circuit boards, but people in PCB industry generally define fine lines as boards with 2 through 5 mil line and spacing. When your board’s minimum line and spacing is …
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Fine Pitch
What’s Fine Pitch Technology? Fine Pitch Technology (FPT) is the term used to describe the printed circuit board (PCB) assembly technology for a family of integrated circuit (IC) packages distinguished by the fine spacing between their small leads. Fine …
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Finished Copper
Finished Copper is the weight or thickness of copper the PCB will have on its surface after electroless plating and electroplating.
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Firmware
In computing, Firmware is a specific class of computer program (/software) that provides the low-level control for a device’s specific hardware. Firmware can either provide a standardized operating environment for more complex device software (allowing more hardware-independence), or, for less …
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First Article
A first article is a test run of a particular manufacturing process. It is useful to verify that all manufacturing parameters are correctly in place. For example when routing PCBs away from a production panel a single board will be …
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