FI-WLP, FO-WLP

Fan-In Wafer-Level Package (FI-WLP)   Fan-In Wafer-Level Package (FI-WLP) refers to the technology of packaging an integrated circuit (IC) at the wafer level, instead of the traditional process of assembling individual dies into packages after dicing them from a wafer. …
Read More

Fiberglass

PCB Fiberglass, or Fiber Glass within the PCB CCL and PP is constructed by weaving fibers of glass yarn together to form fabric-like fiberglass sheets. These sheets are then impregnated with an epoxy resin to form the core (cured resin) and …
Read More

Fill Area

A large conductive area such as a ground or power plane.
Read More

Fillet

The junction where to surfaces meet, as in solder fillet.
Read More

Filter

What’s a Filter?   A Filter is a circuit capable of passing (or amplifying) certain frequencies while attenuating other frequencies. Thus, a filter can extract important frequencies from signals that also contain undesirable or irrelevant frequencies. In the field of …
Read More

Fine Line

IPC has no specific definition for a Fine Line in printed circuit boards, but people in PCB industry generally define fine lines as boards with 2 through 5 mil line and spacing. When your board’s minimum line and spacing is …
Read More

Fine Pitch

What’s Fine Pitch Technology?   Fine Pitch Technology (FPT) is the term used to describe the printed circuit board (PCB) assembly technology for a family of integrated circuit (IC) packages distinguished by the fine spacing between their small leads. Fine …
Read More

Finished Copper

Finished Copper is the weight or thickness of copper the PCB will have on its surface after electroless plating and electroplating.
Read More

Firmware

In computing, Firmware is a specific class of computer program (/software) that provides the low-level control for a device’s specific hardware. Firmware can either provide a standardized operating environment for more complex device software (allowing more hardware-independence), or, for less …
Read More

First Article

A first article is a test run of a particular manufacturing process. It is useful to verify that all manufacturing parameters are correctly in place. For example when routing PCBs away from a production panel a single board will be …
Read More