MAP-BGA

What’s MAP-BGA?   The MAP-BGA, or MAPBGA (Mold Array Process Ball Grid Array) package is a surface mount package that uses a grid of solder balls for electrical connections. The individual units are arranged in a matrix array on a …
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Master Pattern

PCB Master Pattern is an accurately scaled pattern, which is used to produce the printed circuit board (PCB) within the accuracy specified in the master drawing. The high accuracy (+1mil or better) flatbed plotter with a programmable, photo image projector …
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Maxwell (unit)

What is Maxwell (unit)?   The maxwell (symbol: Mx) is the CGS (centimeter–gram–second) unit of magnetic flux (Φ). It is a unit name honors James Clerk Maxwell, who presented a unified theory of electromagnetism.   The maxwell is a non-SI …
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MCM

A Multichip Module (MCM) or package is defined as a single unit (“package”) containing two or more chips and an interconnection substrate which function together as a system building block. The MCM, or Multichip Package (MCP), provides signal interconnect and …
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MCM-L

Multi-Chip Module-Laminated (MCM-L), based on organic laminate technology. Each type of MCM has its place in the technological hierarchy. MCM-L is derived from conventional PCB technology and makes more use of enhance materials and processes, high-definition photolithographic techniques, and strict …
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MCU

A microcontroller (MCU for microcontroller unit) is a small computer on a single metal-oxide-semiconductor (MOS) integrated circuit (IC) chip. In modern terminology, it is similar to, but less sophisticated than, a system on a chip (SoC); a SoC may include …
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Measling

A form of delamination just below the surface of the laminate material that is visible and shows as several small circular areas.
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Measlling

Discrete white spots or crosses below the surface of the base laminate that reflect a separation of fibers in the glass cloth at the weave intersection.
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MELF

Metal Electrode Leadless Face Bonded (MELF) A (usually cylindrical) surface mount component package that has a metallic cap termination at each end instead of metallization. Commonly used for diodes, capacitors and resistors.
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