Underwriter’s Laboratories, Inc., a corporation supported by some underwriters for the purpose of establishing safety standards on types of equipment or components.
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Electronic Glossary
UL 94
UL 94, the Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances testing, is a plastics flammability standard released by Underwriters Laboratories (UL) of the United States. The standard determines the material’s tendency to either …
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Ultra Fine-Pitch
As with fine-pitch, a term whose value depends on the date of the definition. The term now (arguably) applies to surface mount packages with a center-to-center lead distance of 0.4mm (0.016in) or less. Also see Fine Pitch.
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Underfill
Underfill is typically a polymer or liquid epoxy that applied to the printed circuit board (PCB) after the board has been subjected to the reflow soldering process in PCB assembly. The underfill is dispensing onto a corner or along the …
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UQFN
Ultra Thin Quad Flat Non-Leaded Package (UQFN or UTQFN) is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads around the periphery of the package body for electrical …
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USB
What’s USB? Universal Serial Bus (USB) is an industry standard that establishes specifications for cables and connectors and protocols for connection, communication and power supply (interfacing) between computers, peripherals and other computers. A broad variety of USB hardware exists, …
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USON
USON is Plastic Ultra-Thin Small Outline No-lead (SON) Package defined by JEDEC, slightly smaller than WSON. It is a surface mounting device (SMD) with 4-16 pins, and the pitch has 0.5mm, 0.65mm (DNP, TI) , and 1.0mm (NLB, TI). Due to …
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UTDFN
What’s UTDFN Package? Ultra Thin Dual Flat No-lead (UTDFN) package is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads along two sides of the package body …
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