What’s PMCP?

 

PMCP -Power Mount Chip Package is a variation of WLCSP (Wafer-Level CSP) for MOSFET power devices made by Panasonic. Panasonic provides a diverse lineup including new ultra-small PMCP with high heat dissipation. MOSFETs for Load Switch features industry leading Low RDS(on).PMCP MOSFET family is optimized for load switches that combine low RDS(on) in a smaller form factor, reduce the power management system size, and minimize power consumption to increase power efficiency.

 

PMCP -Power Mount Chip Package

PMCP -Power Mount Chip Package

 

PMCP Features

 

  • New small, thin package power mount chip package with high heat dissipation
  • Newly-developed small, thin package PMCP featuring high thermal dissipation
  • 46% smaller, 67% thinner, 82% lower, and 5% higher (thermal dissipation) compared to previous package
  • 47% lower on-resistance
  • On-resistance per unit area reduced by 47% by combining the 110-nm fine process and wafer thinning technologies

 

New Technology

 

  • Adopting a new heat discharging frame structure: PMCP utilizes the new package structure of unique pad design and drain clip technology, which achieves higher thermal performance over the current products. The thermal design utilizes a frame structure to optimize thermal dissipation from the chip to both the PCB and air; a higher thermal dissipation over conventional product has been achieved while achieving small size and low-profile.
  • 110nm fine trench cell with wafer thinning fabrication technology: Panasonic’s advance in cell technology and wafer thinning fabrication have led to silicon with lower specific on resistance. Normally, in an N-channel power MOSFET, current flows from the substrate to the channel. Increasing the number of cells by using 110nm fine process technology reduces the resistance of the channel. In addition, using wafer thinning technology reduces the resistance of the substrate.