Solderability Test: All you need to know

The evaluation of a metal to determine its ability to be wetted by solder according to 202, Method 208; MIL-STD 883, Method 2003.10; IPC-TM-650, Method 2.4.12 Solderability test.

The Solderability test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages.

Solderability testing provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using SnPb or Pb-free solder. The procedure, considered to be destructive, will test whether the packaging materials and processes used during the manufacturing operations produce a component that can be successfully soldered in the next level of assembly.

There are two methods of solderability testing. Method 1 is known as “dip and look” which is for leaded and leadless terminations. This method includes pre-conditioning if applicable, the application of flux, and the immersion of the terminations into molten solder. Method 2 is a Surface Mount Process Simulation test. All you need to know is, All you need to know to learn with details on the MADPCB website set by step