Thin Shrink Quad Flat Package (TSQFP) is a surface-mount IC package with gull wing leads on all four sides of the quad flat package (QFP) body. The lead pitches are always 0.30mm, 0.40mm, 0.50mm or 0.55mm with height equal to or less than 1.60mm.
Other Quad Flat Package (QFP) Types
| Package |
| BQFP: bumpered quad flat package |
| BQFPH: bumpered quad flat package with heat spreader |
| CQFP: ceramic quad flat package |
| EQFP: plastic enhanced quad flat package |
| FQFP: fine pitch quad flat package |
| LQFP: low profile quad flat package |
| MQFP: metric quad flat package |
| NQFP: near chip-scale quad flat package |
| SQFP: small quad flat package |
| TQFP: thin quad flat package |
| VQFP: very small quad flat package |
| VTQFP: very thin quad flat package |
| TDFN: thin dual flat no-lead package |