What’s VFBGA Package?
Very Thin Profile Fine Pitch Ball Grid Array (VFBGA) is a thinner version of the TFBGA package. Like all BGA packages, VFBGAs use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. The VFBGA is near-chip-scale in size and features ball pitch values that are even tighter than those of the TFBGA.
Very Thin Profile Fine Pitch Ball Grid Array (VFBGA)
Typical VFBGAs have ball counts that range from 120 to 476 solder balls. The typical VFBGA ball pitch is 0.4mm to 0.75mm. The typical package thickness is greater than 0.80mm but not more than 1.0mm.
| Properties of Some VFBGAs | |||
| No. of Balls | Body Size | Package Size (incl. solder balls) |
Ball Pitch |
| 45 | 3 x 6mm | 1.0mm | 0.50mm |
| 48 | 6 x 8mm | 1.0mm | 0.75mm |
| 49 | 5 x 5mm | 1.0mm | 0.65mm |
| 56 | 4.5 x 7mm | 1.0mm | 0.65mm |
| 84 | 4.6 x 4.6mm | 1.0mm | 0.40mm |
| 100 | 6 x 6mm | 1.0mm | 0.50mm |
| 100 | 8 x 8mm | 1.0mm | 0.75mm |
| 168 | 12 x 12mm | 0.9mm | 0.50mm |
| 432 | 11 x 11mm | 1.0mm | 0.40mm |