ELIC Flex PCB with EMI Shielding Film and Metal Stiffener

ELIC Flex PCB with EMI Shielding Film and Metal Stiffener

• Layer Count: 3 layers
• HDI Level: Every Layer Interconnect (ELIC)
• Structure: 3 Flex
• Material: Panasonic FCCL (see stack-up)
• Stiffener: Stainless Steel, with shape pre-made, then to laminate.
• FPC Thickness: 0.19mm+/-0.03mm
• Finger Zone Thickness without Stiffener: 0.17mm+/-0.03mm
• Metal Stiffener: 0.2mm+/-0.03mm
• EMI Shielding Film: black x2
• Coverlay: black x2
• Silkscreen: white x1
• Unit Size: 120 x 65mm
• Panel Size: no
• Finished Copper Weight: 20/10/20μm
• Surface Finish: Hard Gold Plating (Au: 25-30μ”, Ni: 120-240μ”)
• Laser Drilled Microvia Dia..: 0.1mm
• Blind Microvia Level: L1-L2, L2-L3
• Hatch Impedance: Yes