Turnkey PCB Assembly Manufacturing for HPC Module

This printed circuit board (PCB) assembly is applied for an HPC module. HPC refers to High-Performance Computing, a supercomputer, which is a computer with a high level of performance as compared to a general-purpose computer.

In this electronics manufacturing project, customer provides us Gerber files, BOM, coordinates and assembly drawing. Because of high-density SMD components placement on top side, their designer makes two sets of top silkscreen layers -one is for printing on this HPC board, another is used for assembly (designator reference). MADPC is responsible HDI board manufacturing, components sourcing and HPC module board assembly with lead-free (RoHS) assembly process.

Layer Count: 6 layers
HDI Level: 1+4+1
Material: FR4 Tg180
Finished Board Thickness: 1.0mm +/-0.1mm
Unit Size: 54.8 54.8mm
Panel Size: 196.4 x 132.6mm/6up (2×3)
Profiling: Milling
Solder Mask: Black x2
Silkscreen: White x2
Finished Inner Copper Weight: 35μm
Finished Outer Copper Weight: 35μm
Surface Finish: Immersion Gold
BGA Pad Qty on Bottom: 2904pcs
Laser Microvias: L1-L2, L5-L6
Buried Vias: Mechanical L2-L5
Assembly Process: Lead-free Assembly
IPC Class 2

Turnkey PCB Assembly Services for HPC Module