CERDIP

What’s CerDIP Package?

 

The Ceramic Dual Inline Package (CerDIP) is a hermetically sealed DIP package that keeps out moisture and contaminants once it is sealed. The CerDIP package is composed of an upper part called the cap, and a lower part called the base. It uses gold-plated leads attached to two sides by brazing and a metal lid bonded to the chip with a metal seal. The base has a cavity where the microchip is mounted.

The base is covered by the cap and then sealed with molten seal glass. The seal glass provides a good hermetic seal once it has cooled down and solidified, which is why hermetic packages, such as the CerDIP are used in military grade devices. See DIP, CERQUAD and chip package.

The CerDIP package has the same high performance characteristics as the standard three-layer ceramic package, yet is a cost-effective alternative. It is a military approved package with excellent reliability characteristics. The cap and the base consist of a single pressed layer of 92% Alumina (Al₂O₃). The base typically has a lead frame that is hermetically embedded in solder glass. Packages are available in a variety of lead counts and body sizes.

CerDIP lead counts range from 8 to 40. It is typically come in wo body widths: the narrow body which is typically slightly less than 300 mils wide and the wide body which is typically slightly less than 600 mils wide. The lead pitch of a cerDIP package is typically 100 mils.