FBGA

What’s FBGA?

 

The Fine Pitch Ball Grid Array, or FPBGA or FBGA, is a smaller version of the ball grid array (BGA) package. As in all BGA packages, FBGA’s use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection.  However, the FBGA is near-chip-scale in size, with a smaller and thinner body than the standard BGA package. As its name implies, it also features a finer ball pitch (smaller distance between balls).

 

 

Typical FBGA’s have ball counts that range from 25 to 529 solder balls. The typical FBGA ball pitch is 0.8 mm to 1.0 mm, although thinner versions of the FBGA such as the TFBGA and the VFBGA can have ball pitches that are as low as 0.4 mm. A typical FBGA is about 1.3 mm to 1.7 mm thick.

Properties of Some FBGAs
No. of Balls	Body Size	Package Height (incl. solder balls)	Ball Pitch
49	7 mm x 7 mm	1.4 mm	0.8 mm
63	10 mm x 10 mm	1.5 mm	0.8 mm
80	9 mm x 9 mm	1.5 mm	0.8 mm
128	11 mm x 11 mm	1.4 mm	0.8 mm
165	15 mm x 17 mm	1.3 mm	1.0 mm

 

For finding a fine pitch BGA assembly and PCB assembly manufacturer, you need to consider the vendor’s PCB assembly process and SMT assembly capabilities. Submit your project to MADPCB, we will helps to remove your headache in components sourcing, board manufacturing, assembly, and even design. All jobs can be done under one roof, and you can save time, energy and cost for more R&D projects.