The Low-Profile Fine Pitch Ball Grid Array (LFBGA, or LFPBGA) is a smaller version of the ball grid array (BGA) package. It is basically an FBGA package that has a package height ranging from 1.2 mm and 1.7 mm. It is therefore thicker than the TFBGA and the VFBGA.
Low-Profile Fine Pitch Ball Grid Array (LFBGA or LFPBGA)
Typical LFBGA’s have ball counts that range from 48 to 865 solder balls. The typical LFBGA ball pitch is 0.50 mm to 0.8 mm. A typical LFBGA is about 1.3 mm to 1.7 mm thick.
| Properties of Some LFBGAs | |||
| No. of Balls | Body Size | Package Height (incl. solder balls) |
Ball Pitch |
| 96 | 5.5 mm x 13.5 mm | 1.4 mm | 0.8 mm |
| 100 | 10 mm x 10 mm | 1.6 mm | 0.8 mm |
| 144 | 10 mm x 10 mm | 1.4 mm | 0.8 mm |
| 225 | 13 mm x 13 mm | 1.5 mm | 0.8 mm |
| 240 | 13 mm x 13 mm | 1.7 mm | 0.65 mm |
| 289 | 15 mm x 15 mm | 1.4 mm | 0.8 mm |
| 357 | 20 mm x 20 mm | 1.5 mm | 0.8 mm |
| 529 | 14 mm x 14 mm | 1.35 mm | 0.5 mm |
| 865 | 17 mm x 17 mm | 1.4 mm | 0.5 mm |