What’s MLP Package?

 

Micro Leadframe Package (MLP) is a JEDEC-compliant, very thin, near-CSP square-shaped or rectangular surface-mount plastic package uses metal pads instead of leads for electrical connection to be outside world. The MLP belongs to the same to the same “no leads” package family as the QFN and the DFN.

Micro Leadframe Package (MLP)

Micro Leadframe Package (MLP)

It is available in three variants:

  1. Dual MLP (MLPD)
  2. Quad MLP (QLPD)
  3. Micro MLP (MLPM)

 

MLPD has pads on only two sides of its package body while the MLPQ has pads all around the periphery of its package body. MLPMs are smaller versions of the standard MLPs, with typical body sizes from 2 mm2 to 3 mm2.

MLPs usually have exposed die attach pads to ensure good thermal conductivity when soldered onto the PCB. Typical MLP pad counts range from 8 to 64. The body thickness of MLPs typically ranges from 0.60mm to 0.90mm. The pad pitch (distance between pads) used by MLPs can range from 0.5mm to 1.27mm.

Properties of Some Examples of MLPs
Type No. of Pads Body Size Body Thickness Pad Pitch
MLPM 8 2 x 3 mm 0.90 mm 0.65 mm
MLPM 8 3 x 3 mm 0.90 mm 0.95 mm
MLPD 8 5 x 6 mm 0.80 mm 1.27 mm
MLPQ 20 4 x 4 mm 0.88 mm 0.5 mm
MLPQ 48 7 x 7 mm 0.90 mm 0.5 mm
MLPQ 56 8 x 8 mm 0.88 mm 0.5 mm