Mini Small Outline Package, Mini-SOP or MSOP, is a very small rectangular plastic package with gull wing leads protruding out of its longer sides. It is a miniaturized version of the SSOP (small outline integrated circuit) package, having a smaller footprint than the latter.
Mini Small Outline Package (Mini-SOP or MSOP)
Mini-SOP are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.
The size of the Mini Small Outline Package is only 3mm x 3mm for the 8 & 10 pins version and 3mm x 4mm for the 12 & 16 pins version. The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.
| Properties of Some Examples | ||||
| Part Number | No. of Pins |
Body Size |
Body Thickness |
Lead Pitch |
| MSOP-8 | 8 | 2.8 x 2.9mm | 1.1mm | 0.65mm |
| MSOP-10 | 10 | 3 x 3mm | 0.85mm | 0.50mm |
| MSOP-12 | 12 | 3 x 4mm | 0.85mm | 0.65mm |
| MSOP-16 | 16 | 3 x 4mm | 0.85mm | 0.50mm |
Synonyms
- μMAX or micro max
- µMAX-EP or micro max exposed pad
- MSE – Linear Technology name for the mini-sop package with exposed pad.