Shrink Small Outline Package (SSOP) is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch. Shrink SOP is leadframe based, plastic encapsulated package that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. These industry-standard IC packages yield a significant reduction in size while running in high volume and provide value-added, low-cost solutions for a wide range of applications.
Shrink Small Outline Package (SSOP)
The lead counts range from 8 to 64. The body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1.65 mm to 1.85 mm. The package is JEDEC– and EIAJ- compliant. SSOPs have solder-plated gull-wing leads that are protruding from the longer sides of the package.
| Properties of some SSOPs | |||
| Part Number | No. of Pins | Body Width | Pitch |
| SSOP8 | 8 | 5.3mm | .65mm |
| SSOP14/16 | 14/16 | 5.3mm | .65mm |
| SSOP20/24 | 20/24 | 5.3mm | .65mm |
| SSOP28 | 28 | 5.3mm | .65mm |
| SSOP48 | 48 | 7.6mm | 1.27mm |
| SSOP56 | 56 | 7.6mm | 1.27mm |
| SSOP64 | 64 | 10.2mm | .8mm |
Features
- Cu wire interconnect for the lowest cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test services, including strip test options
- Green materials are standard – Pb-free and RoHS compliant
- Stealth dicing (narrow saw streets)
- Larger/higher density leadframe strips
- Leadframe roughing for improved MSL capability
See Chip Package, IC, SOIC, SOP, TSOP, TSSOP, QSOP and VSOP. Turnkey PCB assembly with components sourcing service at MADPCB.