What’s TSOP Package?

 

Thin Small Outline Package (TSOP) is a rectangular IC package with a thickness of 1.0 mm. The lead counts range from 20 to 48. Thin SOP IC’s are packed in JEDEC trays or tape and reel (quantities may vary). There are two types of TSOPs.

  • Type I TSOP has its leads protruding from the shorter edges of the package.
  • Type II TSOP has its leads protruding from the longer edges of the package.
Thin Small Outline Package (TSOP)

Thin Small Outline Package (TSOP)

 

Properties of Some Type 1 TSOPs
Part Number No. of Pins Body Size Lead Pitch
TSOP20/24 20/24 6 x 14.4mm 0.5mm
TSOP28 28 8.1 x 11.8mm 0.55mm
TSOP28/32 28/32 8 x 18.4mm 0.5mm
TSOP40 40 10 x 18.4mm 0.5mm
TSOP48 48 12 x 18.4mm 0.5mm

 

Properties of Some Type 2 TSOPs
Part Number No. of Pins Body Size Lead Pitch
TSOP20/24/26 20/24/26 7.6 x 17.14mm 1.27mm
TSOP24/28 24/28 10.16 x 18.41mm 1.27mm
TSOP32 32 10.16 x 20.95mm 1.27mm
TSOP40/44 40/44 10.16 x 18.42mm 0.8mm
TSOP50 50 10.16 x 20.95mm 0.8mm
TSOP54 54 12.7 x 22.22mm 0.8mm
TSOP66 66 10.16 x 22.22mm 0.65mm

 

See Chip Package, IC, SOIC, SOP, SSOP, TSSOP, QSOP and VSOP. Turnkey PCB assembly with components sourcing service at MADPCB.