Electronic Glossary

A negatively charged electrode, as of an electrolytic cell, a storage battery, or an electron tube.

What’s Ceramic BGA?   Ceramic Ball Grid Array (CBGA) is a square-shaped or rectangular ceramic package that uses solder balls for external electrical connection instead of leads. These solder balls are arranged in a grid or array at the bottom …

What’s Ceramic CGA?   Ceramic Colum Grid Array (CCGA) is a square-shaped or rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls. These solder columns are arranged in a grid array at …

Carbon Composition Resistor (CCR) consists of a solid cylindrical resistive element with embedded wire leads or metal end caps to which the lead wires are attached. The body of the resistor is protected with paint or plastic. The resistive element …

Ceramic DIP. See CERDIP.

Composite Epoxy Materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 and CEM-3, designated by NEMA, …

Capacitor in which the dielectric is ceramic.

1. What Are Ceramic PCBs?   Ceramic PCB(s) are the printed circuit boards which are manufactured with ceramic (Al2O3, AlN, SiN) substrates by the means of Direct Plated Copper (DPC), Direct Bonded Copper (DBC) and Active Metal Brazing (AMB) technologies. …

What’s CerDIP Package?   The Ceramic Dual Inline Package (CerDIP) is a hermetically sealed DIP package that keeps out moisture and contaminants once it is sealed. The CerDIP package is composed of an upper part called the cap, and a lower …

What’s CerPack?   Ceramic Package (CerPack) is a hermetically sealed rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP), like …