Electronic Glossary

CERamic QUAD, or CERQUAD, is a square, ceramic, surface mount chip package. It uses a ceramic lid that is bonded to the chip with a glass seal. It has pins on all four sides that wrap under like those of …

What’s CFP Package?   CFP stands for Ceramic FlatPack. which is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two …

What’s CGA Package?   CGA (Column Grid Array) IC Packages are made with non-collapsible solder columns for surface mount soldering on printed circuit board (PCB). Most CGA packages have large ceramic substrates (also called CCGA) 21mm to 52.5mm. It is …

A broken corner to eliminate an otherwise sharp edge.

A compound measurement of the resistance, inductance, conductance and capacitance of a transmission line expressed in ohms. In impedance controlled circuit board, its value depends on the width and thickness of the trace, the spacing from the conductor to ground …

Pen plots that are suitable for checking only. Pads are represented as circles and thick traces as rectangular outlines instead of filled-in artwork. This technique is used to enhance transparency of multiple layers.

The individual circuit or component of a silicon wafer, the leadless form of an electronic component. Also refer to IC or processor.

What Is A Chip Carrier?   In electronics, a Chip Carrier is one of several kinds of surface-mount technology packages for integrated circuits (ICs). Connections are made on all four edges of a square package; compared to the internal cavity …

Chip package is the housing or carrier that IC chips are placed in. The chip package is then either plugged into (socket mount) or soldered onto (surface mount) the printed circuit board. Creating a mounting for a chip might seem …

A protective device used to open a circuit when current exceeds a maximum value. In effect a reusable fuse.