Electronic Glossary

SMD Packages are available in wider range of shapes and sizes and are generally designed to be placed on PCB boards by machines rather than by hand. SMT components or SMDs have a number of standardized packages including 1206, 0805, …

Solder Mask Over Bare Copper (SMOBC). The application of a solder mask directly on a circuit board rather than the copper first being plated in another alloy

What Is A SMT Feeder?   SMT Feeder, (also called SMT Feeding Gun, Component Feeder, or Part Feeder), is an electric device to lock tape-and-reel SMD components, peel off the tape (film) cover on the top of components, and feeds …

A System on a Chip (SoC) is an integrated circuit (/chip) that integrated all or most components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memory, input/output ports and secondary storage, …

Soft gold is commonly referred to as “wire bondable gold”. It is softer than other gold finishes which allows it to be bonded to more easily for stronger and more conductive connections. The gold does not disappear at the point …

SOIC is the abbreviations of Small Outline Integrated Circuit, which is a surface mounting IC package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to …

What’s SOJ Package?   Small Outline J-Lead (SOJ) Package is a small rectangular surface-mount plastic-molded integrated circuit (IC) package with two rows of J-leads and standard spacing between leads and rows. The leads protrude from the longer edge of the …

In BGA chip packages, solder balls  are the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a “solder bump“. See BGA.

The unwanted joining of adjacent land or pads by solder.

What Is Solder Bump?   In Integrated circuit (IC) packaging, a Solder Bump, also a Solder Ball, or referred simply as “ball” or “bumps”, is a ball of solder that provides the contact between chip package and printed circuit board, …