What’s SOJ Package?
Small Outline J-Lead (SOJ) Package is a small rectangular surface-mount plastic-molded integrated circuit (IC) package with two rows of J-leads and standard spacing between leads and rows. The leads protrude from the longer edge of the package. It is also sometimes referred to as SOIJ or J-leaded small outline IC package. Generally used for memory devices, where the rows of leads are typically on the narrow edges. Most of these parts use finer pitches than standard SOICs, and are also substantially thinner.
System-in-Package (SiP)
SOJ packages are JEDED-compliant and come in a variety of body widths, the most popular of which are 7.5mm (300mil) and 10.2mm (400mil). The standard pitch is nominally 1.27mm (50mil). The SMD components may be shipped in tubes or tape and reel.
A similar package outline that has gull wing leads instead of J-shaped is known as the SOIC.
| Properties of some SOJs | |||
| Number of Pins |
Body Size | Body Height incl. Leads |
Lead Pitch |
| 16 | 7.5 x 12.8mm | 2.9mm | 1.27mm |
| 18 | 7.5 x 11.5mm | 2.9mm | 1.27mm |
| 24 | 7.5 x 15.4mm | 2.9mm | 1.27mm |
| 28 | 10.2 x 18.4mm | 3.5mm | 1.27mm |
| 32 | 10.2 x 20.9mm | 3.5mm | 1.27mm |
| 36 | 10.2 x 23.5mm | 3.5mm | 1.27mm |
| 40 | 10.2 x 26mm | 3.5mm | 1.27mm |