Electronic Glossary

In PCB Assembly industry, a Bill of Materials (BOM), a document that lists all electronic, electrical, and mechanical components, and supporting materials that are required for manufacturing a PCB assembly, and gives the quantities used. The BOM will use reference …

The force per unit area required to separate two adjacent layers of a board by a force perpendicular to the board surface.

Bondply, also called Bond-Ply, or Bond Ply, which can be either a flexible printed circuit (FPC) material with adhesive + Polyimide (PI) + adhesive structure, or a printed circuit board (PCB) material with an unreinforced, hydrocarbon based thin film adhesive …

Boolean Logic is a form of algebra which is centered around three simple words known as Boolean Operators: “Or,” “And,” and “Not”. At the heart of Boolean Logic is the idea that all values are either true or false. Within …

Printed circuit boards are manufactured on a larger panel and then individually routed out. That production panel has a border area in order to allow for tooling holes and room for mounting to equipment during the manufacturing process. Typically that …

Bow references the flatness of a printed circuit board. In the case of a bow all four corners of the board would be able to touch a flat surface equally but the middle area of the board would not be …

What’s BQFP Package?   BQFP stands for Bumper Quad Flat Package.

In PCB materials, the breakdown voltage of an insulator is the minimum voltage that causes a portion of an insulator to become electrically conductive. Trace width/spacing, dielectric (FR-4, PP, polyimide, PTFE) thickness and etc.

Breakout in PCB means poor registration between the hole and the pad on a printed circuit board to the degree that the hole is not within the area of the pad. Through hole pads need a solid annular ring for …

Minimum voltage required to cause a DIAC to break down and conduct.