What’s PSOP?
Power Small Outline Package (PSOP) is a rectangular small outline IC (SOIC) package that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip’s ability to dissipate heat and thus handle more power. The PSOP achieves 40% θJA improvement over that of standard SOIC’s.
Power Small Outline Package (PSOP)
Power SOP is offered with a low stand-off of 2 mils (0.002 inch). The leads are mechanically connected to but electrically isolated from the heat slug. There are two types, including PSOP-2 and PSOP-3. The PSOP-2 has a standard exposed heat slug while the PSOP-3 has an enlarged exposed heat slug that protrudes out of the package bottom, allowing the slug to be thermally connected to the printed circuit board (PCB) for greater heat dissipation capability. This kind package has good SMT assembly result.
| Properties of Some Examples | |||||
| Package Type | No. of Pins | Body Width | Body Length | Body Thickness | Lead Pitch |
| PSOP-2 | 8 | 3.8 mm | 4.93 mm | 1.52 mm | 1.27 mm |
| PSOP-2 | 16 | 3.8 mm | 9.93 mm | 1.52 mm | 1.27 mm |
| PSOP-2 | 16 | 7.6 mm | 10.33 mm | 2.34 mm | 1.27 mm |
| PSOP-2 | 20 | 7.6 mm | 12.83 mm | 2.34 mm | 1.27 mm |
| PSOP-2 | 24 | 7.6 mm | 15.42 mm | 2.34 mm | 1.27 mm |
| PSOP-2 | 28 | 7.6 mm | 17.93 mm | 2.34 mm | 1.27 mm |
| PSOP-3 | 20 | 11 mm | 15.90 mm | 3.15 mm | 1.27 mm |
| PSOP-3 | 24 | 11 mm | 15.90 mm | 3.15 mm | 1.00 mm |
| PSOP-3 | 30 | 11 mm | 15.90 mm | 3.15 mm | 0.80 mm |
| PSOP-3 | 36 | 11 mm | 15.90 mm | 3.15 mm | 0.65 mm |