WSON is Plastic Small-Outline No-Lead (SON) Package defined by JEDEC. DMB/PWSON and DOD are common seen WSONs from Texas Instruments. It varies from various pins, similar to SOIC, but generally with 8 pins (all also have exposed thermal pads). It’s also hard to solder with a soldering iron due to the underside thermal pad. WSON is commonly used for flash memory ICs, and secondary-side bias regulators for DC-DC converters.
WSON-8
- Package: 6.0×5.0x0.80mm (w/h, Winbond package code ZP)
- Recommended Land Pattern: 6.10×5.10mm (31.11mm2)
The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.